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Wire bond NPI engineer, Die bond NPI engineer, Mold NPI engineer and 5 more

Wire bond NPI engineer, Die bond NPI engineer, Mold NPI engineer and 5 more, found 10 days ago on LinkedIn. Based in Seremban, Malaysia. The recruiter asks for CVs by email.

Product manager LinkedIn 10 days ago
Posted by Telexis Group

A recruitment firm is hiring several engineering and leadership roles for a global semiconductor company that is expanding its assembly and test operations in Seremban.

About this job

Job
Wire bond NPI engineer, Die bond NPI engineer, Mold NPI engineer and 5 more
Category
Product manager
Location
Seremban, Malaysia
Posted
on LinkedIn, 29 October 2026
How to apply
By email to the recruiter, with your CV

How to apply to this product manager job

  1. Click Apply. A free PileSkip account receives this post and the recruiter's email address.
  2. PileSkip drafts a short, personal email for this post from your CV and profile, in the post's language. Edit it as you like.
  3. Start the campaign: the email leaves your own Gmail with your CV attached, so the reply comes straight to you.

The recruiter published this post and asked for applications by email. PileSkip shows a summary written by AI from the post, so check the details when you apply; the address goes to a signed-in account, which can then send a personal email and CV from its own Gmail. Post #10480.

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